Copper

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Data Sheet
Cu-ETP DIN EN 13601 (CW004A)
Material
Composition in %
Density around g/cm3
Mech. Properties
Tensile Strength Rm (Mpa)
Yield Point Rp 0.2 (Mpa)
Elongation A (%)
Cu-ETP
Cu min. 99,90 Bi max. 0,005 O max. 0,040 Pb max. 0,005
8,9
250
180
15
Characteristics:Oxygenic copper with high conductivity for heat and electricity. Due to the oxygen content, no requirements can be made for the brazability and weldability.
Use:Use when high electrical conductivity is required. Electrical engineering, mechanical engineering.
Remark:Moderate to severe machinability.
Comparable specification:E-Cu 2.0060
Cu-DHP DIN EN 1652 (CW024A, R240)
Material
Composition in %
Density around g/cm3
Mech. Properties
Tensile Strength Rm (Mpa)
Yield Point Rp 0.2 (Mpa)
Elongation A (%)
Cu-DHP
Cu Min. 99,90 P 0,015-0,040
8,9
240-260
Max. 180
8

(These data refer to sheets in condition R240).

Characteristics:Deoxidised copper with limited high residual phosphorous, which has a hydrogen resistance and has very good welding and hardsoldering properties.
Use:Machine- and apparatus construction, roof and wall coverings, medicine.
Remark:Moderate to severe machinability.
Comparable specification:SF-Cu 2.0090
Cu-HCP DIN EN 13599 (CW021A)
Werkstoff
Zusammensetzung in %
Dichte ca. g/cm³
Zugfestigkeit Rm (Mpa)
Dehngrenze Rp 0,2 (Mpa)
Bruchdehnung A (%)
Cu-HCP CW021A R220
Cu Min. 99,95 P 0,002-0,007
8,9
220-260
Max. 140
42

(These data relate to plates).

Characteristics:Desoxidised and highly purified copper with a low residual phosphorous content which has a high conductivity for electricity and heat. Very good weldability, solderability and hydrogen resistance.
Use:Components for electronic and electrical engineering as well as plating material.
Remark:Moderate to severe machinability.
Comparable specification:SE-Cu 2.0070
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